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MC68EN360AI25L | NXP

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NXP MC68EN360AI25L


RoHS Compliant

Ordering Info

In Stock: 0

MOQ: 2

Package Quantity: 1

COO: CN

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Quantity Cost
2 -

Electrical Characteristics

JESD-30 Code S-PQFP-G240
JESD-609 Code e3
Moisture Sensitivity Level 3
Number of Terminals 240
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Peak Reflow Temperature (Cel) 260
Surface Mount YES
Technology CMOS
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
uPs/uCs/Peripheral ICs Type RISC MICROCONTROLLER