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Learn more about ECAD Model here.Electrical Characteristics
| Additional Feature | YES |
| Clock Frequency-Max | 88 |
| In-System Programmable | YES |
| JESD-30 Code | S-PBGA-B256 |
| JESD-609 Code | e0 |
| JTAG BST | YES |
| Length | 17 |
| Moisture Sensitivity Level | 3 |
| Number of Dedicated Inputs | 0 |
| Number of I/O Lines | 164 |
| Number of Macro Cells | 256 |
| Number of Terminals | 256 |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Organization | 0 DEDICATED INPUTS, 164 I/O |
| Output Function | MACROCELL |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LBGA |
| Package Equivalence Code | BGA256,16X16,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE |
| Peak Reflow Temperature (Cel) | 240 |
| Power Supplies | 3.3 |
| Programmable Logic Type | EE PLD |
| Propagation Delay | 12 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.55 |
| Sub Category | Programmable Logic Devices |
| Supply Voltage-Max | 3.6 |
| Supply Voltage-Min | 3 |
| Supply Voltage-Nom | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Terminal Form | BALL |
| Terminal Pitch | 1 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 17 |