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Electrical Characteristics
| Access Time-Max | 45 |
| JESD-30 Code | R-PDSO-G28 |
| JESD-609 Code | e3 |
| Length | 18.3895 |
| Memory Density | 65536 |
| Memory IC Type | NON-VOLATILE SRAM |
| Memory Width | 8 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 28 |
| Number of Words | 8192 |
| Number of Words Code | 8K |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Organization | 8KX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | SOP |
| Package Equivalence Code | SOP28,.5 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2.794 |
| Standby Current-Max | 0.00075 |
| Sub Category | SRAMs |
| Supply Current-Max | 0.065 |
| Supply Voltage-Max (Vsup) | 5.5 |
| Supply Voltage-Min (Vsup) | 4.5 |
| Supply Voltage-Nom (Vsup) | 5 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Width | 8.6865 |