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Learn more about ECAD Model here.Electrical Characteristics
| Construction | Chip |
| Element Power Dissipation | 0.1 |
| First Element Resistance | 2200 |
| JESD-609 Code | e3 |
| Manufacturer Series | 2QSP |
| Mounting Feature | SURFACE MOUNT |
| Network Type | BUSSED |
| Number of Elements | 15 |
| Number of Functions | 1 |
| Number of Terminals | 16 |
| Operating Temperature-Max | 125 |
| Operating Temperature-Min | -55 |
| Package Height | 1.35 |
| Package Length | 4.98 |
| Package Shape | RECTANGULAR PACKAGE |
| Package Style | SMT |
| Package Width | 3.81 |
| Packing Method | TUBE |
| Rated Power Dissipation (P) | 0.75 |
| Rated Temperature | 70 |
| Resistance | 2200 |
| Resistor Type | ARRAY/NETWORK RESISTOR |
| Series | 2QSP(BUSSED) |
| Size Code | 1620 |
| Sub Category | Array/Network Resistors |
| Technology | THIN FILM |
| Temperature Coefficient | 150 |
| Temperature Coefficient Tracking | 25 |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Shape | GULL WING |
| Tolerance | 5 |
| Working Voltage | 50 |