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Learn more about ECAD Model here.Electrical Characteristics
| Construction | Chip |
| Element Power Dissipation | 0.08 |
| First Element Resistance | 10000 |
| JESD-609 Code | e0 |
| Lead Spacing | 1.27 |
| Mounting Feature | SURFACE MOUNT |
| Network Type | BUSSED |
| Number of Elements | 15 |
| Number of Functions | 1 |
| Number of Terminals | 16 |
| Operating Temperature-Max | 125 |
| Operating Temperature-Min | -55 |
| Package Height | 2.03 |
| Package Length | 11.18 |
| Package Shape | RECTANGULAR PACKAGE |
| Package Style | SMT |
| Package Width | 5.59 |
| Packing Method | TR |
| Rated Power Dissipation (P) | 1.28 |
| Rated Temperature | 70 |
| Reference Standard | AEC-Q200 |
| Resistance | 10000 |
| Resistor Type | ARRAY/NETWORK RESISTOR |
| Size Code | 2244 |
| Sub Category | ARRAY/NETWORK RESISTOR |
| Technology | METAL GLAZE/THICK FILM |
| Temperature Coefficient | 100 |
| Temperature Coefficient Tracking | 50 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Shape | GULL WING |
| Tolerance | 2 |
| Working Voltage | 50 |