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Learn more about ECAD Model here.Electrical Characteristics
Construction | Chip |
Element Power Dissipation | 0.08 |
First Element Resistance | 4700 |
JESD-609 Code | e2 |
Lead Spacing | 1.27 |
Mounting Feature | SURFACE MOUNT |
Network Type | BUSSED |
Number of Elements | 15 |
Number of Functions | 1 |
Number of Terminals | 16 |
Operating Temperature-Max | 125 |
Operating Temperature-Min | -55 |
Package Height | 2.03 |
Package Length | 11.18 |
Package Shape | RECTANGULAR PACKAGE |
Package Style | SMT |
Package Width | 5.59 |
Packing Method | TUBE |
Rated Power Dissipation (P) | 1.28 |
Rated Temperature | 70 |
Reference Standard | AEC-Q200 |
Resistance | 4700 |
Resistor Type | ARRAY/NETWORK RESISTOR |
Series | 4800P |
Size Code | 2244 |
Sub Category | ARRAY/NETWORK RESISTOR |
Technology | METAL GLAZE/THICK FILM |
Temperature Coefficient | 100 |
Temperature Coefficient Tracking | 50 |
Terminal Finish | Tin/Copper (Sn/Cu) |
Terminal Shape | GULL WING |
Tolerance | 2 |
Working Voltage | 50 |