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Learn more about ECAD Model here.Electrical Characteristics
Construction | Chip |
Element Power Dissipation | 0.16 |
First Element Resistance | 100 |
JESD-609 Code | e0 |
Lead Spacing | 1.27 |
Manufacturer Series | 4800P |
Mounting Feature | SURFACE MOUNT |
Network Type | ISOLATED |
Number of Elements | 1 |
Number of Functions | 10 |
Number of Terminals | 20 |
Operating Temperature-Max | 125 |
Operating Temperature-Min | -55 |
Package Height | 2.03 |
Package Length | 13.72 |
Package Shape | RECTANGULAR PACKAGE |
Package Style | SMT |
Package Width | 5.59 |
Packing Method | TR |
Rated Power Dissipation (P) | 1.6 |
Rated Temperature | 70 |
Reference Standard | AEC-Q200 |
Resistance | 100 |
Resistor Type | ARRAY/NETWORK RESISTOR |
Series | 4800P |
Size Code | 2254 |
Sub Category | ARRAY/NETWORK RESISTOR |
Technology | METAL GLAZE/THICK FILM |
Temperature Coefficient | 100 |
Temperature Coefficient Tracking | 50 |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Shape | GULL WING |
Tolerance | 2 |
Working Voltage | 50 |