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Electrical Characteristics
| Address Bus Width | 20 |
| Bit Size | 16 |
| Boundary Scan | NO |
| Clock Frequency-Max | 32 |
| External Data Bus Width | 16 |
| Format | FIXED POINT |
| Integrated Cache | NO |
| JESD-30 Code | S-CPGA-P68 |
| JESD-609 Code | e0 |
| Length | 29.275 |
| Low Power Mode | YES |
| Number of DMA Channels | 2 |
| Number of External Interrupts | 5 |
| Number of Serial I/Os | 0 |
| Number of Terminals | 68 |
| On Chip Data RAM Width | 0 |
| Operating Temperature-Max | 125 |
| Operating Temperature-Min | -55 |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED |
| Package Code | PGA |
| Package Equivalence Code | PGA68,11X11 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 5 |
| Qualification Status | Not Qualified |
| RAM (words) | 0 |
| Screening Level | 38535Q/M;38534H;883B |
| Seated Height-Max | 4.57 |
| Speed | 16 |
| Sub Category | Microprocessors |
| Supply Current-Max | 90 |
| Supply Voltage-Max | 5.5 |
| Supply Voltage-Min | 4.5 |
| Supply Voltage-Nom | 5 |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) - hot dipped |
| Terminal Form | PIN/PEG |
| Terminal Pitch | 2.54 |
| Terminal Position | PERPENDICULAR |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 29.275 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |