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Learn more about ECAD Model here.Electrical Characteristics
Additional Feature | MACROCELLS INTERCONNECTED BY PIA; 32 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
Architecture | PAL-TYPE |
Clock Frequency-Max | 27 |
JESD-30 Code | R-GDIP-T28 |
JESD-609 Code | e0 |
Length | 37.0205 |
Number of Dedicated Inputs | 7 |
Number of I/O Lines | 16 |
Number of Inputs | 24 |
Number of Outputs | 16 |
Number of Product Terms | 320 |
Number of Terminals | 28 |
Operating Temperature-Max | 125 |
Operating Temperature-Min | -55 |
Organization | 7 DEDICATED INPUTS, 16 I/O |
Output Function | MACROCELL |
Package Body Material | CERAMIC, GLASS-SEALED |
Package Code | WDIP |
Package Equivalence Code | DIP28,.3 |
Package Shape | RECTANGULAR |
Package Style | IN-LINE, WINDOW |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies | 5 |
Programmable Logic Type | UV PLD |
Propagation Delay | 40 |
Qualification Status | Not Qualified |
Screening Level | 38535Q/M;38534H;883B |
Seated Height-Max | 5.08 |
Sub Category | Programmable Logic Devices |
Supply Voltage-Max | 5.5 |
Supply Voltage-Min | 4.5 |
Supply Voltage-Nom | 4.5 |
Surface Mount | NO |
Technology | CMOS |
Temperature Grade | MILITARY |
Terminal Finish | Tin/Lead (Sn/Pb) - hot dipped |
Terminal Form | THROUGH-HOLE |
Terminal Pitch | 2.54 |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 7.62 |