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Learn more about ECAD Model here.Electrical Characteristics
| Amplifier Type | BUFFER |
| Average Bias Current-Max (IIB) | 5 |
| Bandwidth (3dB)-Nom | 200 |
| Bias Current-Max (IIB) @25C | 5 |
| Input Offset Voltage-Max | 8200 |
| JESD-30 Code | S-CQCC-N20 |
| JESD-609 Code | e0 |
| Length | 8.89 |
| Neg Supply Voltage Limit-Max | -7 |
| Neg Supply Voltage-Nom (Vsup) | -5 |
| Number of Functions | 4 |
| Number of Terminals | 20 |
| Operating Temperature-Max | 125 |
| Operating Temperature-Min | -55 |
| Output Current-Min | 0.02 |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED |
| Package Code | QCCN |
| Package Equivalence Code | LCC20,.35SQ |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | -5 |
| Qualification Status | Not Qualified |
| Screening Level | MIL-STD-883 |
| Seated Height-Max | 1.905 |
| Slew Rate-Min | 180 |
| Slew Rate-Nom | 450 |
| Sub Category | Buffer Amplifier |
| Supply Current-Max | 17 |
| Supply Voltage Limit-Max | 7 |
| Supply Voltage-Nom (Vsup) | 5 |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) - hot dipped |
| Terminal Form | NO LEAD |
| Terminal Pitch | 1.27 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Total Dose | MIL-STD-883 |
| Width | 8.89 |