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![74AHC1G07GV,125 | NEXPERIA](/Content/Images/default-part-photo.jpg)
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Learn more about ECAD Model here.Electrical Characteristics
Family | AHC |
JESD-30 Code | R-PDSO-G5 |
JESD-609 Code | e3 |
Length | 2.9 |
Logic IC Type | BUFFER |
Moisture Sensitivity Level | 1 |
Number of Functions | 1 |
Number of Inputs | 1 |
Number of Terminals | 5 |
Operating Temperature-Max | 125 |
Operating Temperature-Min | -40 |
Output Characteristics | OPEN-DRAIN |
Package Body Material | PLASTIC/EPOXY |
Package Code | TSSOP |
Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Cel) | 260 |
Propagation Delay (tpd) | 12.5 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.1 |
Supply Voltage-Max (Vsup) | 5.5 |
Supply Voltage-Min (Vsup) | 2 |
Supply Voltage-Nom (Vsup) | 5 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | AUTOMOTIVE |
Terminal Finish | Tin (Sn) |
Terminal Form | GULL WING |
Terminal Pitch | .95 |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 1.5 |