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Learn more about ECAD Model here.NEXPERIA 74HC2G17GV,125
Ordering Info
In Stock: 0
MOQ: 3000
Package Quantity: 3000
Quantity | Cost |
---|---|
3000 | - |
Electrical Characteristics
Family | HC/UH |
JESD-30 Code | R-PDSO-G6 |
JESD-609 Code | e3 |
Length | 2.9 |
Logic IC Type | BUFFER |
Moisture Sensitivity Level | 1 |
Number of Functions | 2 |
Number of Inputs | 1 |
Number of Terminals | 6 |
Operating Temperature-Max | 125 |
Operating Temperature-Min | -40 |
Package Body Material | PLASTIC/EPOXY |
Package Code | TSOP |
Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Propagation Delay (tpd) | 175 |
Seated Height-Max | 1.1 |
Supply Voltage-Max (Vsup) | 6 |
Supply Voltage-Min (Vsup) | 2 |
Supply Voltage-Nom (Vsup) | 5 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | AUTOMOTIVE |
Terminal Finish | Tin (Sn) |
Terminal Form | GULL WING |
Terminal Pitch | .95 |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 1.5 |