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MICROCHIP 93LC66B/SN
4K, 256 X 16 SERIAL EE. Package: 8 SOIC 3.90mm(.150in) TUBE - MID-DENSITY SERIAL EE Product Line
Ordering Info
In Stock: 0
MOQ: 200
Package Quantity: 100
HTS Code: 8542.32.0051
ECCN: EAR99
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 200 | - |
Electrical Characteristics
| Additional Feature | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS |
| Clock Frequency-Max (fCLK) | 2 |
| Data Retention Time-Min | 200 |
| Endurance | 1000000 |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e3 |
| Length | 4.9 |
| Memory Density | 4096 |
| Memory IC Type | EEPROM |
| Memory Width | 16 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Terminals | 8 |
| Number of Words | 256 |
| Number of Words Code | 256 |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Organization | 256X16 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | SOP |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 5-Mar |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.75 |
| Serial Bus Type | MICROWIRE |
| Standby Current-Max | 1e-06 |
| Sub Category | EEPROMs |
| Supply Current-Max | 0.0015 |
| Supply Voltage-Max (Vsup) | 6 |
| Supply Voltage-Min (Vsup) | 2.5 |
| Supply Voltage-Nom (Vsup) | 3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 3.9 |
| Write Cycle Time-Max (tWC) | 6 |
| Write Protection | SOFTWARE |