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Electrical Characteristics
| Clock Frequency-Max (fCLK) | 100 |
| Data Retention Time-Min | 20 |
| Endurance | 100000 |
| JESD-30 Code | R-PDIP-T8 |
| Memory Density | 2097152 |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Terminals | 8 |
| Number of Words | 262144 |
| Number of Words Code | 256K |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 256KX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | DIP |
| Package Equivalence Code | DIP8,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 3/3.3 |
| Programming Voltage | 3 |
| Qualification Status | Not Qualified |
| Serial Bus Type | SPI |
| Standby Current-Max | .000015 |
| Sub Category | Flash Memories |
| Supply Current-Max | .024 |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Type | NOR TYPE |
| Write Protection | HARDWARE/SOFTWARE |