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Electrical Characteristics
| Clock Frequency-Max (fCLK) | 104 |
| Data Retention Time-Min | 10 |
| Endurance | 100000 |
| JESD-30 Code | R-PBGA-B24 |
| Memory Density | 67108864 |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Terminals | 24 |
| Number of Words | 8388608 |
| Number of Words Code | 8M |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 8MX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Equivalence Code | BGA24,4X6,40 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Parallel/Serial | SERIAL |
| Power Supplies | 3/3.3 |
| Qualification Status | Not Qualified |
| Serial Bus Type | SPI |
| Standby Current-Max | .00001 |
| Sub Category | Flash Memories |
| Supply Current-Max | .025 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 1 |
| Terminal Position | BOTTOM |
| Type | NOR TYPE |
| Write Protection | HARDWARE/SOFTWARE |