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Learn more about ECAD Model here.Electrical Characteristics
| Access Time-Max | 7 |
| Clock Frequency-Max (fCLK) | 105 |
| I/O Type | COMMON |
| Interleaved Burst Length | 1,2,4,8 |
| JESD-30 Code | S-PBGA-B54 |
| Memory Density | 33554432 |
| Memory IC Type | SYNCHRONOUS DRAM |
| Memory Width | 16 |
| Number of Terminals | 54 |
| Number of Words | 2097152 |
| Number of Words Code | 2M |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Organization | 2MX16 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | FBGA |
| Package Equivalence Code | BGA54,9X9,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, FINE PITCH |
| Power Supplies | 1.8 |
| Qualification Status | Not Qualified |
| Refresh Cycles | 4096 |
| Sequential Burst Length | 1,2,4,8,FP |
| Standby Current-Max | .00001 |
| Sub Category | DRAMs |
| Supply Current-Max | .06 |
| Supply Voltage-Nom (Vsup) | 1.8 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Form | BALL |
| Terminal Pitch | .8 |
| Terminal Position | BOTTOM |