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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 70 |
Additional Feature | EMBEDDED ALGORITHM; HARDWARE DATA PROTECTION |
Command User Interface | YES |
Data Polling | YES |
Endurance | 100000 |
JESD-30 Code | R-PQCC-J32 |
JESD-609 Code | e0 |
Length | 13.97 |
Memory Density | 1048576 |
Memory IC Type | FLASH |
Memory Width | 8 |
Number of Functions | 1 |
Number of Sectors/Size | 8 |
Number of Terminals | 32 |
Number of Words | 131072 |
Number of Words Code | 128K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Organization | 128KX8 |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | QCCJ |
Package Equivalence Code | LDCC32,.5X.6 |
Package Shape | RECTANGULAR |
Package Style | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies | 5 |
Programming Voltage | 5 |
Qualification Status | Not Qualified |
Seated Height-Max | 3.556 |
Sector Size | 16K |
Standby Current-Max | 0.0001 |
Sub Category | Flash Memories |
Supply Current-Max | 0.05 |
Supply Voltage-Max (Vsup) | 5.5 |
Supply Voltage-Min (Vsup) | 4.5 |
Supply Voltage-Nom (Vsup) | 5 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | J BEND |
Terminal Pitch | 1.27 |
Terminal Position | QUAD |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Toggle Bit | YES |
Type | NOR TYPE |
Width | 11.43 |