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Learn more about ECAD Model here.Electrical Characteristics
| Address Bus Width | 28 |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 26 |
| External Data Bus Width | 16 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B324 |
| JESD-609 Code | e1 |
| Length | 15 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 324 |
| Operating Temperature-Max | 90 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Equivalence Code | BGA324,18X18,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 0.95/1.1 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.4 |
| Speed | 800 |
| Sub Category | Microprocessors |
| Supply Current-Max | 400 |
| Supply Voltage-Max | 1.326 |
| Supply Voltage-Min | 1.21 |
| Supply Voltage-Nom | 1.26 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 15 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |