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Electrical Characteristics
| Additional Feature | HALF DUPLEX; FULL DUPLEX |
| Data Rate | 1.2 |
| JESD-30 Code | R-CDIP-T28 |
| JESD-609 Code | e0 |
| Length | 38.4302 |
| Neg Supply Voltage-Nom | -5 |
| Number of Functions | 1 |
| Number of Terminals | 28 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED |
| Package Code | DIP |
| Package Equivalence Code | DIP28,.6 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | -5 |
| Qualification Status | Not Qualified |
| Sub Category | Modems |
| Supply Current-Max | 0.16 |
| Supply Voltage-Nom | 5 |
| Surface Mount | NO |
| Technology | MOS |
| Telecom IC Type | MODEM |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 15.24 |