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Learn more about ECAD Model here.Electrical Characteristics
Additional Feature | 10 X 19 FRAME STATUS FIFO |
Address Bus Width | 0 |
Boundary Scan | NO |
Bus Compatibility | 8080; Z80; 6800; 68000; 80188; 80186; 80286; MULTIBUS |
Clock Frequency-Max | 10 |
Communication Protocol | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC; ADCCP |
Data Encoding/Decoding Method | NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
Data Transfer Rate-Max | 0.3125 |
External Data Bus Width | 8 |
JESD-30 Code | S-PQCC-J44 |
JESD-609 Code | e0 |
Length | 16.5862 |
Low Power Mode | NO |
Number of DMA Channels | 0 |
Number of I/O Lines | 0 |
Number of Serial I/Os | 2 |
Number of Terminals | 44 |
On Chip Data RAM Width | 0 |
Operating Temperature-Max | 70 |
Operating Temperature-Min | 0 |
Package Body Material | PLASTIC/EPOXY |
Package Code | QCCJ |
Package Equivalence Code | LDCC44,.7SQ |
Package Shape | SQUARE |
Package Style | CHIP CARRIER |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies | 5 |
Qualification Status | Not Qualified |
RAM (words) | 0 |
Seated Height-Max | 4.57 |
Sub Category | Other Microprocessor ICs |
Supply Current-Max | 18 |
Supply Voltage-Max | 5.5 |
Supply Voltage-Min | 4.5 |
Supply Voltage-Nom | 5 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | J BEND |
Terminal Pitch | 1.27 |
Terminal Position | QUAD |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 16.5862 |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |