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Ordering Info
In Stock: 6
MOQ: 1
Package Quantity: 1
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 1+ | $71.25 |
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Electrical Characteristics
| Access Time-Max | 300 |
| I/O Type | COMMON |
| JESD-30 Code | R-XDIP-T22 |
| JESD-609 Code | e0 |
| Memory Density | 4096 |
| Memory IC Type | STANDARD SRAM |
| Memory Width | 4 |
| Number of Terminals | 22 |
| Number of Words | 1024 |
| Number of Words Code | 1K |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 125 |
| Operating Temperature-Min | -55 |
| Organization | 1KX4 |
| Output Characteristics | 3-STATE |
| Package Body Material | CERAMIC |
| Package Code | DIP |
| Package Equivalence Code | DIP22,.4 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Screening Level | MIL-STD-883 Class B (Modified) |
| Sub Category | SRAMs |
| Surface Mount | NO |
| Technology | MOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |