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Electrical Characteristics
| Access Time-Max | 50 |
| Clock Frequency-Max (fCLK) | 12.5 |
| JESD-30 Code | S-PQCC-J20 |
| JESD-609 Code | e0 |
| Length | 8.9662 |
| Memory Density | 131072 |
| Memory IC Type | CONFIGURATION MEMORY |
| Memory Width | 1 |
| Moisture Sensitivity Level | 2 |
| Number of Functions | 1 |
| Number of Terminals | 20 |
| Number of Words | 131072 |
| Number of Words Code | 128K |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Organization | 128KX1 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | QCCJ |
| Package Equivalence Code | LDCC20,.4SQ |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | 225 |
| Power Supplies | 5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 4.57 |
| Standby Current-Max | 0.001 |
| Sub Category | EEPROMs |
| Supply Current-Max | 0.01 |
| Supply Voltage-Max (Vsup) | 5.25 |
| Supply Voltage-Min (Vsup) | 4.75 |
| Supply Voltage-Nom (Vsup) | 5 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | J BEND |
| Terminal Pitch | 1.27 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 8.9662 |