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NXP BAP50-05,215
Ordering Info
In Stock: 0
MOQ: 3000
Package Quantity: 3000
COO: CN
Subject to tariff fees.
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 3000 | - |
Electrical Characteristics
| Breakdown Voltage-Min | 50 |
| Configuration | COMMON CATHODE, 2 ELEMENTS |
| Diode Capacitance-Max | 0.6 |
| Diode Capacitance-Nom | 0.6 |
| Diode Element Material | SILICON |
| Diode Forward Resistance-Max | 40 |
| Diode Res Test Current | 0.5 |
| Diode Res Test Frequency | 100 |
| Diode Type | PIN DIODE |
| JESD-30 Code | R-PDSO-G3 |
| JESD-609 Code | e3 |
| Moisture Sensitivity Level | 1 |
| Number of Elements | 2 |
| Number of Terminals | 3 |
| Operating Temperature-Max | 150 |
| Operating Temperature-Min | -65 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 |
| Power Dissipation-Max | 0.25 |
| Qualification Status | Not Qualified |
| Reverse Test Voltage | 1 |
| Sub Category | PIN Diodes |
| Surface Mount | YES |
| Technology | POSITIVE-INTRINSIC-NEGATIVE |
| Terminal Finish | Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 |