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Learn more about ECAD Model here.Electrical Characteristics
Additional Feature | LOGIC LEVEL COMPATIBLE |
Avalanche Energy Rating (Eas) | 10 |
Case Connection | DRAIN |
Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
DS Breakdown Voltage-Min | 30 |
Drain Current-Max (Abs) (ID) | 20 |
Drain Current-Max (ID) | 8 |
Drain-source On Resistance-Max | 0.022 |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
JESD-30 Code | R-PDSO-F6 |
JESD-609 Code | e3 |
Moisture Sensitivity Level | 1 |
Number of Elements | 2 |
Number of Terminals | 6 |
Operating Mode | ENHANCEMENT MODE |
Operating Temperature-Max | 150 |
Package Body Material | PLASTIC/EPOXY |
Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE |
Peak Reflow Temperature (Cel) | 260 |
Polarity/Channel Type | N-CHANNEL |
Power Dissipation-Max (Abs) | 26 |
Pulsed Drain Current-Max (IDM) | 80 |
Qualification Status | Not Qualified |
Sub Category | FET General Purpose Power |
Surface Mount | YES |
Terminal Finish | MATTE TIN |
Terminal Form | FLAT |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 40 |
Transistor Application | SWITCHING |
Transistor Element Material | SILICON |