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Electrical Characteristics
| JESD-30 Code | R-PBGA-B63 |
| JESD-609 Code | e4 |
| Length | 20.5 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 63 |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | -20 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LGA |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 250 |
| Seated Height-Max | 2.38 |
| Supply Voltage-Nom | 3.3 |
| Surface Mount | YES |
| Telecom IC Type | WIRELESS LAN CIRCUIT |
| Temperature Grade | OTHER |
| Terminal Finish | GOLD NICKEL |
| Terminal Form | BUTT |
| Terminal Pitch | 1.27 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 17.5 |