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Electrical Characteristics
| Access Time-Max | 25 |
| JESD-30 Code | R-PBGA-B48 |
| JESD-609 Code | e1 |
| Length | 10 |
| Memory Density | 4194304 |
| Memory IC Type | NON-VOLATILE SRAM |
| Memory Width | 8 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 48 |
| Number of Words | 524288 |
| Number of Words Code | 512K |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 512KX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA |
| Package Equivalence Code | BGA48,6X8,30 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 3/3.3 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.2 |
| Standby Current-Max | 0.005 |
| Sub Category | SRAMs |
| Supply Current-Max | 0.07 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 2.7 |
| Supply Voltage-Nom (Vsup) | 3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.75 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 6 |