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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 25 |
JESD-30 Code | R-PDSO-G32 |
JESD-609 Code | e3 |
Length | 20.726 |
Memory Density | 262144 |
Memory IC Type | NON-VOLATILE SRAM |
Memory Width | 8 |
Moisture Sensitivity Level | 3 |
Number of Functions | 1 |
Number of Terminals | 32 |
Number of Words | 32768 |
Number of Words Code | 32K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Organization | 32KX8 |
Package Body Material | PLASTIC/EPOXY |
Package Code | SOP |
Package Equivalence Code | SOP32,.4 |
Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 3/3.3 |
Qualification Status | Not Qualified |
Seated Height-Max | 2.54 |
Standby Current-Max | 0.005 |
Sub Category | SRAMs |
Supply Current-Max | 0.07 |
Supply Voltage-Max (Vsup) | 3.6 |
Supply Voltage-Min (Vsup) | 2.7 |
Supply Voltage-Nom (Vsup) | 3 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Matte Tin (Sn) |
Terminal Form | GULL WING |
Terminal Pitch | 1.27 |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 7.505 |