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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 45 |
I/O Type | COMMON |
JESD-30 Code | R-PDSO-G32 |
JESD-609 Code | e4 |
Length | 11.8 |
Memory Density | 1048576 |
Memory IC Type | STANDARD SRAM |
Memory Width | 8 |
Moisture Sensitivity Level | 3 |
Number of Functions | 1 |
Number of Terminals | 32 |
Number of Words | 131072 |
Number of Words Code | 128K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Organization | 128KX8 |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | TSSOP |
Package Equivalence Code | TSSOP32,.56,20 |
Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 2.5/3.3 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.2 |
Standby Current-Max | 3e-06 |
Standby Voltage-Min | 1.5 |
Sub Category | SRAMs |
Supply Current-Max | 0.016 |
Supply Voltage-Max (Vsup) | 3.6 |
Supply Voltage-Min (Vsup) | 2.2 |
Supply Voltage-Nom (Vsup) | 3 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal Form | GULL WING |
Terminal Pitch | 0.5 |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 8 |