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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 10 |
I/O Type | COMMON |
JESD-30 Code | R-PBGA-B48 |
JESD-609 Code | e0 |
Length | 8.5 |
Memory Density | 4194304 |
Memory IC Type | STANDARD SRAM |
Memory Width | 16 |
Moisture Sensitivity Level | 3 |
Number of Functions | 1 |
Number of Terminals | 48 |
Number of Words | 262144 |
Number of Words Code | 256K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Organization | 256KX16 |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA |
Package Equivalence Code | BGA48,6X8,30 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 240 |
Power Supplies | 3.3 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.2 |
Standby Current-Max | 0.01 |
Standby Voltage-Min | 3 |
Sub Category | SRAMs |
Supply Current-Max | 0.1 |
Supply Voltage-Max (Vsup) | 3.6 |
Supply Voltage-Min (Vsup) | 3 |
Supply Voltage-Nom (Vsup) | 3.3 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | BALL |
Terminal Pitch | 0.75 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 7 |