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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 3.4 |
Additional Feature | PIPELINED ARCHITECTURE |
Clock Frequency-Max (fCLK) | 167 |
I/O Type | COMMON |
JESD-30 Code | R-PQFP-G100 |
JESD-609 Code | e3 |
Length | 20 |
Memory Density | 75497472 |
Memory IC Type | ZBT SRAM |
Memory Width | 36 |
Moisture Sensitivity Level | 3 |
Number of Functions | 1 |
Number of Terminals | 100 |
Number of Words | 2097152 |
Number of Words Code | 2M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Organization | 2MX36 |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | LQFP |
Package Equivalence Code | QFP100,.63X.87 |
Package Shape | RECTANGULAR |
Package Style | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 2.5/3.3,3.3 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.6 |
Standby Voltage-Min | 3.14 |
Sub Category | SRAMs |
Supply Current-Max | 0.45 |
Supply Voltage-Max (Vsup) | 3.6 |
Supply Voltage-Min (Vsup) | 3.135 |
Supply Voltage-Nom (Vsup) | 3.3 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Matte Tin (Sn) |
Terminal Form | GULL WING |
Terminal Pitch | 0.65 |
Terminal Position | QUAD |
Time@Peak Reflow Temperature-Max (s) | 40 |
Width | 14 |