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Ordering Info
In Stock: 0
MOQ: 136
Package Quantity: 136
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 136 | - |
Electrical Characteristics
| Access Time-Max | 0.45 |
| Additional Feature | PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V |
| Clock Frequency-Max (fCLK) | 250 |
| I/O Type | SEPARATE |
| JESD-30 Code | R-PBGA-B165 |
| JESD-609 Code | e1 |
| Length | 15 |
| Memory Density | 75497472 |
| Memory IC Type | QDR SRAM |
| Memory Width | 18 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 165 |
| Number of Words | 4194304 |
| Number of Words Code | 4M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Organization | 4MX18 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LBGA |
| Package Equivalence Code | BGA165,11X15,40 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.5/1.8,1.8 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.4 |
| Standby Voltage-Min | 1.7 |
| Sub Category | SRAMs |
| Supply Current-Max | 0.65 |
| Supply Voltage-Max (Vsup) | 1.9 |
| Supply Voltage-Min (Vsup) | 1.7 |
| Supply Voltage-Nom (Vsup) | 1.8 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 1 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 13 |