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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 50 |
I/O Type | COMMON |
JESD-30 Code | R-PDIP-T24 |
JESD-609 Code | e0 |
Memory Density | 16384 |
Memory IC Type | OTP ROM |
Memory Width | 8 |
Number of Functions | 1 |
Number of Terminals | 24 |
Number of Words | 2048 |
Number of Words Code | 2K |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 70 |
Operating Temperature-Min | 0 |
Organization | 2KX8 |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | DIP |
Package Equivalence Code | DIP24,.3 |
Package Shape | RECTANGULAR |
Package Style | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies | 5 |
Programming Voltage | 13.5 |
Qualification Status | Not Qualified |
Standby Current-Max | 0.09 |
Sub Category | OTP ROMs |
Supply Current-Max | 0.09 |
Supply Voltage-Max (Vsup) | 5.5 |
Supply Voltage-Min (Vsup) | 4.5 |
Supply Voltage-Nom (Vsup) | 5 |
Surface Mount | NO |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | THROUGH-HOLE |
Terminal Pitch | 2.54 |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |