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Learn more about ECAD Model here.Electrical Characteristics
| Access Time-Max | 8 |
| Clock Frequency-Max (fCLK) | 100 |
| Cycle Time | 10 |
| JESD-30 Code | R-PQCC-J32 |
| JESD-609 Code | e0 |
| Length | 13.97 |
| Memory Density | 73728 |
| Memory IC Type | OTHER FIFO |
| Memory Width | 9 |
| Number of Functions | 1 |
| Number of Terminals | 32 |
| Number of Words | 8192 |
| Number of Words Code | 8K |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 8KX9 |
| Output Characteristics | 3-STATE |
| Output Enable | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | QCCJ |
| Package Equivalence Code | LDCC32,.5X.6 |
| Package Shape | RECTANGULAR |
| Package Style | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 225 |
| Power Supplies | 5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 3.55 |
| Standby Current-Max | 0.04 |
| Sub Category | FIFOs |
| Supply Current-Max | 0.17 |
| Supply Voltage-Max (Vsup) | 5.5 |
| Supply Voltage-Min (Vsup) | 4.5 |
| Supply Voltage-Nom (Vsup) | 5 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | J BEND |
| Terminal Pitch | 1.27 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 11.43 |