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Electrical Characteristics
| Address Bus Width | 0 |
| Bit Size | 8 |
| Boundary Scan | NO |
| Bus Compatibility | USB |
| CPU Family | M8C |
| Clock Frequency-Max | 25.2 |
| External Data Bus Width | 0 |
| JESD-30 Code | S-XQCC-N32 |
| JESD-609 Code | e4 |
| Length | 5 |
| Moisture Sensitivity Level | 3 |
| Number of I/O Lines | 28 |
| Number of Terminals | 32 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | UNSPECIFIED |
| Package Code | HVQCCN |
| Package Equivalence Code | LCC32,.2SQ,20 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.8/5 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 2048 |
| RAM (words) | 2K |
| ROM (words) | 16384 |
| ROM Programmability | FLASH |
| Seated Height-Max | 0.6 |
| Speed | 25.2 |
| Sub Category | Microcontrollers |
| Supply Current-Max | 4 |
| Supply Voltage-Max | 5.5 |
| Supply Voltage-Min | 1.71 |
| Supply Voltage-Nom | 3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 5 |