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Ordering Info
In Stock: 0
MOQ: 260
Package Quantity: 260
Subject to tariff fees.
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 260 | - |
Electrical Characteristics
| JESD-30 Code | S-XQCC-N56 |
| JESD-609 Code | e4 |
| Length | 7 |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 56 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | UNSPECIFIED |
| Package Code | HVQCCN |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Seated Height-Max | 0.6 |
| Supply Voltage-Max | 5.5 |
| Supply Voltage-Min | 1.71 |
| Supply Voltage-Nom | 1.8 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 7 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |