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Electrical Characteristics
| Boundary Scan | YES |
| Bus Compatibility | I2C |
| Clock Frequency-Max | 48 |
| JESD-30 Code | S-XQCC-N56 |
| JESD-609 Code | e4 |
| Length | 7 |
| Moisture Sensitivity Level | 3 |
| Number of I/O Lines | 36 |
| Number of Terminals | 56 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | UNSPECIFIED |
| Package Code | HVQCCN |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| RAM (words) | 16K |
| Seated Height-Max | 0.6 |
| Supply Voltage-Max | 5.5 |
| Supply Voltage-Min | 1.71 |
| Supply Voltage-Nom | 1.8 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 7 |