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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 4 |
Additional Feature | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
Clock Frequency-Max (fCLK) | 167 |
I/O Type | COMMON |
JESD-30 Code | S-PBGA-B484 |
JESD-609 Code | e1 |
Length | 27 |
Memory Density | 37748736 |
Memory IC Type | DUAL-PORT SRAM |
Memory Width | 36 |
Moisture Sensitivity Level | 3 |
Number of Functions | 1 |
Number of Ports | 2 |
Number of Terminals | 484 |
Number of Words | 1048576 |
Number of Words Code | 1M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Organization | 1MX36 |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Equivalence Code | BGA484,22X22,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 1.5/1.8 |
Qualification Status | Not Qualified |
Seated Height-Max | 2.46 |
Standby Current-Max | 0.7 |
Standby Voltage-Min | 1.4 |
Sub Category | SRAMs |
Supply Current-Max | 1.47 |
Supply Voltage-Max (Vsup) | 1.58 |
Supply Voltage-Min (Vsup) | 1.42 |
Supply Voltage-Nom (Vsup) | 1.5 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form | BALL |
Terminal Pitch | 1 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 27 |