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Learn more about ECAD Model here.Electrical Characteristics
| Access Time-Max | 15000 |
| Additional Feature | MICROLAN COMPATIBLE |
| I/O Type | COMMON |
| JESD-30 Code | O-MEDB-N2 |
| JESD-609 Code | e3 |
| Memory Density | 1024 |
| Memory IC Type | OTP ROM |
| Memory Width | 1 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Terminals | 2 |
| Number of Words | 1024 |
| Number of Words Code | 1K |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 1KX1 |
| Package Body Material | METAL |
| Package Equivalence Code | BUTTON,.68IN |
| Package Shape | ROUND |
| Package Style | DISK BUTTON |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 3/5 |
| Qualification Status | Not Qualified |
| Sub Category | Other Memory ICs |
| Supply Voltage-Max (Vsup) | 6 |
| Supply Voltage-Min (Vsup) | 2.8 |
| Supply Voltage-Nom (Vsup) | 5 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Position | END |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |