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Ordering Info
In Stock: 20
MOQ: 1
Package Quantity: 1
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
Quantity | Cost |
---|---|
1 | - |
Electrical Characteristics
Access Time-Max | 85 |
Additional Feature | SRAM IS ORGANISED AS 512K X 8 OR 256K X 16 |
JESD-30 Code | R-PBGA-B69 |
JESD-609 Code | e0 |
Length | 11 |
Memory Density | 16777216 |
Memory IC Type | MEMORY CIRCUIT |
Memory Width | 16 |
Mixed Memory Type | FLASH+SRAM |
Number of Functions | 1 |
Number of Terminals | 69 |
Number of Words | 1048576 |
Number of Words Code | 1M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -25 |
Organization | 1MX16 |
Package Body Material | PLASTIC/EPOXY |
Package Code | LFBGA |
Package Equivalence Code | BGA69,10X10,32 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
Power Supplies | 3 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.4 |
Standby Current-Max | 5e-06 |
Sub Category | Other Memory ICs |
Supply Current-Max | 0.045 |
Supply Voltage-Max (Vsup) | 3.3 |
Supply Voltage-Min (Vsup) | 2.7 |
Supply Voltage-Nom (Vsup) | 3 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | OTHER |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | BALL |
Terminal Pitch | 0.8 |
Terminal Position | BOTTOM |
Width | 8 |