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Learn more about ECAD Model here.Electrical Characteristics
| Access Time-Max | 85 |
| Additional Feature | SRAM IS ORGANISED AS 512K X 8 OR 256K X 16 |
| JESD-30 Code | R-PBGA-B69 |
| JESD-609 Code | e0 |
| Length | 11 |
| Memory Density | 16777216 |
| Memory IC Type | MEMORY CIRCUIT |
| Memory Width | 16 |
| Mixed Memory Type | FLASH+SRAM |
| Number of Functions | 1 |
| Number of Terminals | 69 |
| Number of Words | 1048576 |
| Number of Words Code | 1M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -25 |
| Organization | 1MX16 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Equivalence Code | BGA69,10X10,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Power Supplies | 3 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.4 |
| Standby Current-Max | 5e-06 |
| Sub Category | Other Memory ICs |
| Supply Current-Max | 0.045 |
| Supply Voltage-Max (Vsup) | 3.3 |
| Supply Voltage-Min (Vsup) | 2.7 |
| Supply Voltage-Nom (Vsup) | 3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Width | 8 |