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Ordering Info
In Stock: 0
MOQ: 5000
Package Quantity: 5000
COO: JP
| Quantity | Cost |
|---|---|
| 5000 | - |
Electrical Characteristics
| Construction | Chip |
| Element Power Dissipation | 0.05 |
| First Element Resistance | 6800 |
| JESD-609 Code | e3 |
| Manufacturer Series | EXBD |
| Mounting Feature | SURFACE MOUNT |
| Network Type | BUSSED |
| Number of Elements | 8 |
| Number of Functions | 1 |
| Number of Terminals | 10 |
| Operating Temperature-Max | 125 |
| Operating Temperature-Min | -55 |
| Package Height | 0.55 |
| Package Length | 3.2 |
| Package Shape | RECTANGULAR PACKAGE |
| Package Style | SMT |
| Package Width | 1.6 |
| Packing Method | TR, PUNCHED, 7 INCH |
| Rated Power Dissipation (P) | 0.05 |
| Rated Temperature | 70 |
| Resistance | 6800 |
| Resistor Type | ARRAY/NETWORK RESISTOR |
| Series | EXB-D |
| Size Code | 1206 |
| Sub Category | ARRAY/NETWORK RESISTOR |
| Technology | METAL GLAZE/THICK FILM |
| Temperature Coefficient | 200 |
| Terminal Finish | Tin (Sn) - with Nickel (Ni) barrier |
| Terminal Shape | WRAPAROUND |
| Tolerance | 5 |
| Working Voltage | 25 |