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Learn more about ECAD Model here.Electrical Characteristics
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e3 |
| Length | 4.9 |
| Memory Density | 1048576 |
| Memory IC Type | MEMORY CIRCUIT |
| Memory Width | 8 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Terminals | 8 |
| Number of Words | 131072 |
| Number of Words Code | 128K |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 128KX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | SOP |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 2.5/3.3 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.75 |
| Standby Current-Max | 0.00015 |
| Sub Category | SRAMs |
| Supply Current-Max | 0.003 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 2 |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 3.9 |