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Learn more about ECAD Model here.Electrical Characteristics
Clock Frequency-Max (fCLK) | 1 |
Data Retention Time-Min | 100 |
Endurance | 1000000 |
I2C Control Byte | 1010MMMR |
JESD-30 Code | R-PDSO-G8 |
JESD-609 Code | e3 |
Length | 4.9 |
Memory Density | 16384 |
Memory IC Type | EEPROM |
Memory Width | 8 |
Moisture Sensitivity Level | 1 |
Number of Functions | 1 |
Number of Terminals | 8 |
Number of Words | 2048 |
Number of Words Code | 2K |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Organization | 2KX8 |
Package Body Material | PLASTIC/EPOXY |
Package Code | SOP |
Package Equivalence Code | SOP8,.25 |
Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies | 1.8/5 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.75 |
Serial Bus Type | I2C |
Standby Current-Max | .000001 |
Sub Category | EEPROMs |
Supply Current-Max | .003 |
Supply Voltage-Max (Vsup) | 5.5 |
Supply Voltage-Min (Vsup) | 1.7 |
Supply Voltage-Nom (Vsup) | 2.5 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Matte Tin (Sn) - annealed |
Terminal Form | GULL WING |
Terminal Pitch | 1.27 |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 3.9 |
Write Cycle Time-Max (tWC) | 5 |
Write Protection | HARDWARE |