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Learn more about ECAD Model here.Electrical Characteristics
| Address Bus Width | 0 |
| Boundary Scan | YES |
| Bus Compatibility | USB |
| Clock Frequency-Max | 25 |
| Data Transfer Rate-Max | 60 |
| External Data Bus Width | 0 |
| JESD-30 Code | S-XQCC-N64 |
| JESD-609 Code | e3 |
| Length | 9 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 64 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | UNSPECIFIED |
| Package Code | HVQCCN |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1 |
| Supply Voltage-Max | 3.6 |
| Supply Voltage-Min | 3 |
| Supply Voltage-Nom | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 9 |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |