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Electrical Characteristics
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Common-mode Reject Ratio-Nom | 96 |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 5000 |
| JESD-30 Code | R-PBGA-B8 |
| JESD-609 Code | e1 |
| Length | 1.869 |
| Low-Bias | YES |
| Low-Offset | NO |
| Micropower | YES |
| Moisture Sensitivity Level | 1 |
| Neg Supply Voltage-Nom (Vsup) | 0 |
| Number of Functions | 2 |
| Number of Terminals | 8 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | FBGA |
| Package Equivalence Code | BGA8,3X3,20 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, FINE PITCH |
| Packing Method | TAPE AND REEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 2.7/15 |
| Qualification Status | Not Qualified |
| Slew Rate-Nom | 1.5 |
| Sub Category | Operational Amplifier |
| Supply Current-Max | 1.9 |
| Supply Voltage Limit-Max | 16 |
| Supply Voltage-Nom (Vsup) | 2.7 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.5 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Unity Gain BW-Nom | 1400 |
| Voltage Gain-Min | 20000 |
| Width | 1.717 |