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Learn more about ECAD Model here.Electrical Characteristics
| JESD-30 Code | R-PBGA-B6 |
| JESD-609 Code | e1 |
| Length | 1.24 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Terminals | 6 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | VFBGA |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Seated Height-Max | 0.675 |
| Supply Voltage-Nom | 4.5 |
| Surface Mount | YES |
| Telecom IC Type | RF AND BASEBAND CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.4 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 0.84 |