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Ordering Info
In Stock: 0
MOQ: 1
Package Quantity: 3000
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| Quantity | Cost |
|---|---|
| 1 | - |
Electrical Characteristics
| Access Time-Max | 12 |
| I/O Type | COMMON |
| JESD-30 Code | R-PBGA-B36 |
| JESD-609 Code | e0 |
| Memory Density | 1048576 |
| Memory IC Type | STANDARD SRAM |
| Memory Width | 8 |
| Number of Terminals | 36 |
| Number of Words | 131072 |
| Number of Words Code | 128K |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Organization | 128KX8 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | FBGA |
| Package Equivalence Code | BGA36,6X8,30 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Power Supplies | 3.3 |
| Qualification Status | Not Qualified |
| Standby Current-Max | .005 |
| Standby Voltage-Min | 2 |
| Sub Category | SRAMs |
| Supply Current-Max | .17 |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | BALL |
| Terminal Pitch | .75 |
| Terminal Position | BOTTOM |