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Learn more about ECAD Model here.Electrical Characteristics
| ADC Channels | YES |
| Address Bus Width | 26 |
| Bit Size | 32 |
| CPU Family | CORTEX-M3 |
| Clock Frequency-Max | 25 |
| DAC Channels | YES |
| DMA Channels | YES |
| External Data Bus Width | 32 |
| JESD-30 Code | S-PBGA-B208 |
| JESD-609 Code | e1 |
| Length | 15 |
| Moisture Sensitivity Level | 2 |
| Number of I/O Lines | 165 |
| Number of Terminals | 208 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA |
| Package Equivalence Code | BGA208,17X17,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 3.3 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 98304 |
| ROM (words) | 524288 |
| ROM Programmability | FLASH |
| Seated Height-Max | 1.2 |
| Speed | 120 |
| Sub Category | Microcontrollers |
| Supply Voltage-Max | 3.6 |
| Supply Voltage-Min | 2.4 |
| Supply Voltage-Nom | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 15 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |