Request Quote













Request Quote


LPC2460FET208,551 | NXP SEMICONDUCTOR

Download the free Library Loader to convert this file for your ECAD Tool.

Learn more about ECAD Model here.

NXP SEMICONDUCTOR LPC2460FET208,551


Ordering Info

In Stock: 0

MOQ: 126

Package Quantity: 126

HTS Code: 0

COO: TW

Quantity Cost
126 -

Electrical Characteristics

ADC Channels YES
Address Bus Width 24
Bit Size 32
CPU Family ARM7
Clock Frequency-Max 24
DAC Channels YES
DMA Channels YES
External Data Bus Width 32
JESD-30 Code S-PBGA-B208
JESD-609 Code e1
Length 15
Moisture Sensitivity Level 2
Number of I/O Lines 160
Number of Terminals 208
Operating Temperature-Max 85
Operating Temperature-Min -40
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 250
Power Supplies 3.3
Qualification Status Not Qualified
RAM (bytes) 100352
ROM (words) 0
ROM Programmability MROM
Seated Height-Max 1.2
Speed 72
Sub Category Microcontrollers
Supply Voltage-Max 3.6
Supply Voltage-Min 3
Supply Voltage-Nom 3.3
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 15
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC