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Learn more about ECAD Model here.Electrical Characteristics
| Clock Frequency-Max (fCLK) | 1 |
| JESD-30 Code | R-PDSO-N8 |
| JESD-609 Code | e4 |
| Length | 3 |
| Memory Density | 16384 |
| Memory IC Type | EEPROM |
| Memory Width | 8 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Terminals | 8 |
| Number of Words | 2048 |
| Number of Words Code | 2K |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 125 |
| Operating Temperature-Min | -40 |
| Organization | 2KX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | HVSON |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | 260 |
| Screening Level | AEC-Q100 |
| Seated Height-Max | .8 |
| Serial Bus Type | I2C |
| Supply Voltage-Max (Vsup) | 5.5 |
| Supply Voltage-Min (Vsup) | 1.8 |
| Supply Voltage-Nom (Vsup) | 2.5 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | NO LEAD |
| Terminal Pitch | .5 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 2 |
| Write Cycle Time-Max (tWC) | 4 |