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Learn more about ECAD Model here.Electrical Characteristics
| Clock Frequency-Max (fCLK) | 1 |
| Data Retention Time-Min | 40 |
| Endurance | 1000000 |
| I2C Control Byte | 1010DDDR |
| JESD-30 Code | R-PBGA-B5 |
| Length | 1.073 |
| Memory Density | 65536 |
| Memory IC Type | EEPROM |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Terminals | 5 |
| Number of Words | 8192 |
| Number of Words Code | 8K |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 8KX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | VFBGA |
| Package Equivalence Code | BGA5,3X3,14/8 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 1.8/5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | .6 |
| Serial Bus Type | I2C |
| Standby Current-Max | .000001 |
| Sub Category | EEPROMs |
| Supply Current-Max | .003 |
| Supply Voltage-Max (Vsup) | 5.5 |
| Supply Voltage-Min (Vsup) | 1.7 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | .2 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | .959 |
| Write Protection | HARDWARE |